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0.7x0.5x0.3mm 0705 CSP LED Wafer Level Chip LED Sealing without Packaging for

Demo Photoelectric Technology (Wuxi) Co., Ltd.
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0.7x0.5x0.3mm 0705 CSP LED Wafer Level Chip LED Sealing without Packaging for

0.7x0.5x0.3mm 0705 CSP LED Wafer Level Chip LED Sealing without Packaging for

Features: The latest generation of LED products utilizes CSP chip-level packaging technology. Manufactured using flip chip technology and fluorescent film. Features excellent resistance to high ...

Product Tags:

CSP LED Wafer Level Chip

      

0705 CSP LED Chip

      

0.7x0.5x0.3mm CSP LED Chip

      
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